Anexo A Placas de evaluación construidas Figura A.1 LNA Figura A.2 MA Figura A.3 PA Figura A.4 Duplexor 700 MHz to 1000 MHz GaAs Matched RF PA Predriver ADL5322 Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved. FEATURES Internally matched to 50 Ω input and output Internally biased Operating frequency: 700 MHz to 1000 MHz Gain: 20 dB OIP3: 45 dBm P1 dB: 27 dBm Noise figure: 5 dB 3 mm × 3 mm LFCSP Power supply: 5 V APPLICATIONS CDMA2000, WCDMA, and GSM base station transceivers and high power amplifiers FUNCTIONAL BLOCK DIAGRAM VCC 5 2 VCC 1 VCC ADL5322 RFIN 8 3 GND 4 RFOUT GND 6 GND 7 BIAS CONTROL IN PU T M A TC H OUTPUT MATCH 06 05 7- 00 1 Figure 1. GENERAL DESCRIPTION The ADL5322 is a high linearity GaAs driver amplifier that is internally matched to 50 Ω for operation in the 700 MHz to 1000 MHz frequency range. The amplifier, which has a gain of 20 dB, is specially designed for use in the output stage of a cellular base station radio or as an input preamplifier in a multicarrier base station power amplifier. Matching and biasing are all on-chip. The ADL5322 is available in a Pb-free, 3mm × 3 mm, 8-lead LFCSP package with an operating temperature from −40°C to +85°C. ADL5322 Rev. 0 | Page 2 of 12 TABLE OF CONTENTS Features .............................................................................................. 1 Applications....................................................................................... 1 Functional Block Diagram .............................................................. 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications..................................................................................... 3 Absolute Maximum Ratings............................................................ 4 ESD Caution.................................................................................. 4 Pin Configuration and Function Descriptions..............................5 Typical Performance Characteristics ..............................................6 Basic Connections .............................................................................8 CDMA2000 Driving Application................................................8 Evaluation Board ............................................................................ 10 Outline Dimensions ....................................................................... 11 Ordering Guide .......................................................................... 11 REVISION HISTORY 7/06—Revision 0: Initial Version ADL5322 Rev. 0 | Page 3 of 12 SPECIFICATIONS VCC = 5 V, TA = 25°C. Table 1. Parameter Conditions Min Typ Max Unit FREQUENCY RANGE 700 1000 MHz GAIN Frequency = 850 MHz 19 20.3 21.4 dB vs. Frequency 832 MHz to 870 MHz ±0.125 dB vs. Temperature −40°C to +85°C ±1 dB vs. Voltage 5 V, @ 5% (4.75 V to 5.25 V) ±0.1 dB Frequency = 900 MHz 18.6 19.9 21.1 dB vs. Frequency 869 MHz to 894 MHz ±0.125 dB vs. Temperature −40°C to +85°C ±1 dB vs. Voltage 5 V, @ 5% (4.75 V to 5.25 V) ±0.1 dB Frequency = 950 MHz 18.3 19.6 20.8 dB vs. Frequency 925 MHz to 960 MHz ±0.125 dB vs. Temperature −40°C to +85°C ±1.1 dB vs. Voltage 5 V, @ 5% (4.75 V to 5.25 V) ±0.1 dB P1 dB Frequency = 850 MHz 27.0 27.7 dBm vs. Frequency 832 MHz to 870 MHz ±0.1 dBm vs. Temperature −40°C to +85°C ±1 dBm vs. Voltage 5 V, @ 5% (4.75 V to 5.25 V) ±0.3 dBm Frequency = 900 MHz 27.3 27.9 dBm vs. Frequency 869 MHz to 894 MHz ±0.1 dBm vs. Temperature −40°C to +85°C ±1 dBm vs. Voltage 5 V, @ 5% (4.75 V to 5.25 V) ±0.4 dBm Frequency = 950 MHz 26.7 27.5 dBm vs. Frequency 925 MHz to 960 MHz ±0.2 dBm vs. Temperature −40°C to +85°C ±1 dBm vs. Voltage 5 V, @ 5% (4.75 V to 5.25 V) ±0.4 dBm NOISE FIGURE Frequency = 830 MHz to 960 MHz 5 dB INPUT RETURN LOSS Frequency = 830 MHz to 960 MHz −10 dB OUTPUT RETURN LOSS Frequency = 830 MHz to 960 MHz −10 dB OIP3 Carrier spacing = 1 MHz, POUT = 5 dBm per carrier Frequency = 850 MHz 44.8 dBm vs. Frequency 832 MHz to 870 MHz ±0.25 dBm vs. Temperature −40°C to +85°C ±3.0 dBm vs. Voltage 5 V, @ 5% (4.75 V to 5.25 V) ±0.5 dBm Frequency = 900 MHz 45.3 dBm vs. Frequency 869 MHz to 894 MHz ±0.25 dBm vs. Temperature −40°C to +85°C ±2.7 dBm vs. Voltage 5 V, @ 5% (4.75 V to 5.25 V) ±0.8 dBm Frequency = 950 MHz 44.4 dBm vs. Frequency 925 MHz to 960 MHz ±0.25 dBm vs. Temperature −40°C to +85°C ±2.2 dBm vs. Voltage 5 V, @ 5% (4.75 V to 5.25 V) ±0.8 dBm POWER SUPPLY Supply Voltage 4.75 5 5.25 V Supply Current POUT = 5 dBm 320 mA Operating Temperature −40 +85 °C ADL5322 Rev. 0 | Page 4 of 12 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating Supply Voltage, VPOS 6 V Input Power (re: 50 Ω) 18 dBm Equivalent Voltage 1.8 V rms θJC (Soldered) 28.5°C/W Maximum Junction Temperature 150°C Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Soldering Temperature 260°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ADL5322 Rev. 0 | Page 5 of 12 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS PIN 1 INDICATOR ADL5322 5 VCC VCC 2 VCC 1 8 RFIN GND 3 RFOUT 4 6 GND 7 GND TOP VIEW (Not to Scale) 06 05 7- 00 2 Figure 2. Pin Configuration Table 3. Pin Function Descriptions Pin No. Mnemonic Description 1, 2, 5 VCC Positive 5 V Supply Voltage. Bypass these three pins with independent power supply decoupling networks (100 pF, 10 nF, and 10 μF). 3, 6, 7 GND Device Ground. 4 RFOUT RF Output. Internally matched to 50 Ω. 8 RFIN RF Input. Internally matched to 50 Ω. N/A EP Exposed Paddle. Connect to ground plane via a low impedance path. Table 4. S-Parameters Frequency ADL5322 (1, 1) ADL5322 (1, 2) ADL5322 (2, 1) ADL5322 (2, 2) 700.0 MHz 0.210/109.457 0.002/97.018 +11.221/−158.622 0.436/150.470 720.0 MHz 0.195/104.437 0.002/93.284 +11.108/−166.579 0.392/145.211 740.0 MHz 0.179/99.101 0.002/87.856 +11.013/−174.596 0.345/137.443 760.0 MHz 0.165/93.363 0.002/86.137 10.931/177.282 0.295/133.051 780.0 MHz 0.151/86.953 0.002/78.668 10.856/169.006 0.242/125.612 800.0 MHz 0.138/79.928 0.002/74.072 10.781/160.613 0.187/116.434 820.0 MHz 0.125/71.950 0.002/68.940 10.698/152.065 0.130/102.897 840.0 MHz 0.114/62.829 0.002/62.269 10.605/143.342 0.079/76.154 860.0 MHz 0.103/52.162 0.002/56.742 10.493/134.489 0.061/18.090 880.0 MHz 0.095/39.531 0.002/56.696 10.361/125.433 +0.098/−26.962 900.0 MHz 0.090/24.952 0.003/43.549 10.210/116.239 +0.153/−46.741 920.0 MHz 0.088/9.188 0.003/37.254 10.033/106.889 +0.211/−58.300 940.0 MHz +0.090/−7.350 0.003/29.904 9.837/97.326 +0.269/−66.606 960.0 MHz +0.095/−23.642 0.003/24.334 9.614/87.600 +0.324/−73.265 980.0 MHz +0.104/−39.131 0.003/16.521 9.364/77.609 +0.376/−78.914 1.000 GHz +0.115/−53.477 0.003/8.139 9.081/67.342 +0.424/−83.911 ADL5322 Rev. 0 | Page 6 of 12 TYPICAL PERFORMANCE CHARACTERISTICS 22.0 17.5 800 1000 FREQUENCY (MHz) G A IN (d B ) 850 900 950 21.5 21.0 20.5 20.0 19.5 19.0 18.5 18.0 TEMP = –40°C TEMP = +25°C TEMP = +85°C 06 05 7- 00 3 Figure 3. Gain vs. Frequency, VCC = 5 V, TA = −40°C, +25°C, and +85°C 29.0 26.0 800 1000 FREQUENCY (MHz) P1 dB (d B m ) 850 900 950 28.5 28.0 27.5 27.0 26.5 TEMP = –40°C TEMP = +25°C TEMP = +85°C 06 05 7- 00 4 Figure 4. P1 dB vs. Frequency, VCC = 5 V, TA = −40°C, +25°C, and +85°C 47 41 800 1000 FREQUENCY (MHz) O IP 3 (d B m ) 850 900 950 46 45 44 43 42 TEMP = –40°C TEMP = +25°C TEMP = +85°C 06 05 7- 00 5 Figure 5. OIP3 vs. Frequency, VCC = 5 V, TA = −40°C, +25°C, and +85°C 5.6 4.0 700 1000 FREQUENCY (MHz) N F (d B ) 800 900 5.4 5.2 5.0 4.8 4.6 4.4 4.2 06 05 7- 00 6 Figure 6. Noise Figure vs. Frequency, Multiple Devices, VS = 5 V, TA = 25°C 28.4 26.4 800 1000 FREQUENCY (MHz) P1 dB (d B m ) 850 900 950 28.2 28.0 27.8 27.6 27.4 27.2 27.0 26.8 26.6 VCC = 5.25V VCC = 5V VCC = 4.75V 06 05 7- 00 7 Figure 7. P1 dB vs. Frequency, VCC = 4.75 V, 5 V, and 5.25 V, TA = 25°C 46.5 43.0 800 1000 FREQUENCY (MHz) O IP 3 (d B m ) 850 900 950 46.0 45.5 45.0 44.5 44.0 43.5 VCC = 5.25V VCC = 5V VCC = 4.75V 06 05 7- 00 8 Figure 8. OIP3 vs. Frequency, VCC = 4. 75 V, 5 V, and 5.25 V, TA = 25°C ADL5322 Rev. 0 | Page 7 of 12 6 0 44.1 OIP3 (dBm) FR EQ U EN C Y 44.3 44.5 44.7 44.9 45.1 45.3 45.5 45.7 5 4 3 2 1 06 05 7- 00 9 Figure 9. Distribution of OIP3 at 850 MHz –6 –26 0.70 1.00 FREQUENCY (GHz) A D L5 32 2 [1 , 1 ] ( dB ) A D L5 32 2 [2 , 2 ] ( dB ) 0.85 0.900.75 0.80 0.95 –14 –16 –18 –20 –22 –24 –8 –10 –12 06 05 7- 01 0 S22 S11 Figure 10. Input S11 and Output S22 Return Loss vs. Frequency 06 05 7- 01 1 7 0 43.6 OIP3 (dBm) FR EQ U EN C Y 43.8 44.0 44.2 44.4 44.6 44.8 45.0 45.2 5 6 4 3 2 1 Figure 11. Distribution of OIP3 at 950 MHz ADL5322 Rev. 0 | Page 8 of 12 BASIC CONNECTIONS Figure 14 shows the basic connections for operating the ADL5322. Each of the three power supply lines should be decoupled with 10 μF, 10 nF, and 100 pF capacitors. Pin 3, Pin 6, Pin 7, and the exposed paddle under the device should all be connected to a low impedance ground plane. If multiple ground planes are being used, these should be stitched together with vias under the device to optimize thermal conduction. See recommended land pattern in Figure 12. 06 05 7- 01 3 Figure 12. Recommended Land Pattern CDMA2000 DRIVING APPLICATION Figure 13 shows a plot of the spectrum of an ADL5323 driving at 4-carrier CDMA2000 signal at 0 dBm per carrier (total carrier power = 6 dBm), centered at 880 MHz. At 750 kHz and 1.98 MHz offset, adjacent channel power ratios of −59 dBc and −84 dBc (measured in 30 kHz with respect to the 1.22 MHz carrier) are observed. At 4 MHz carrier offset, −73 dBc is measured in a 1 MHz bandwidth (−133 dBm/Hz). Note that the spectrum of the four carriers is slightly rounded due the frequency response of the cavity-tuned filter that was used to filter out the noise and distortion of the source signal. –10 –110 CENTER 881.875MHz SPAN 10MHz (d B m ) 1MHz/ –50 –60 –70 –80 –90 –100 –20 –30 –40 RBW = 30kHz VBW = 300kHz SWT = 2s RF ATT = 20dB MIXER = –10dBm CH PWR = 0.26dBm ACP UP = –59.33dB ALT1 UP = –84.35dB ALT2 UP = –72.74dB 06 05 7- 01 4 Figure 13. Spectrum of 4 Adjacent CDMA2000 Carriers Centered at 880 MHz; Total Carrier Power = 6 dBm (0 dBm per Carrier) AGNDAGNDAGND AGND VCC RFIN RFOUT ADL5322 VCC VCC GND GND RFIN VCC GND RFOUT C4 100pF EP 8 7 6 5 1 2 3 4 AGND C2 100pF C1 10µF C3 10nF C5 100pF VCC VCC AGNDAGNDAGND C11 10µF C9 100pF C10 10nF AGNDAGNDAGND C8 10µF C6 100pF C7 10nF 06 05 7- 01 2 Figure 14. Basic Connections ADL5322 Rev. 0 | Page 9 of 12 Figure 15 shows how ACP varies with output power level. The close-in ACP is a function of the signal coding and is unaffected by output headroom at these power levels. The ACP measured at 1.98 MHz carrier offset is −72 dBc at 10 dBm output power (12 dB below the required 60 dBc). At 4 MHz carrier offset, the noise and distortion measured in a 1 MHz bandwidth is −75 dBm at 6 dBm (total) output power (0 dBm per carrier). In a 50 dBm transmitter, this corresponds to an antenna-referred output power of −31 dBm (1 MHz), which is 18 dB below what is required by the CDMA2000 standard. –30 –100 –10 OUTPUT POWER (dBm) A C P1 A N D A C P2 – 3 0k H z R B W (d B c) A C P3 – 1 M H z R B W (d B m ) 10 –50 –40 –60 –70 –80 –90 –30 –100 –50 –40 –60 –70 –80 –90 –8 –6 –4 –2 0 2 4 6 8 ACP1 (dBc) – 750kHz OFFSET – 30kHz RBW ACP3 (dBm) – 4MHz OFFSET – 1MHz RBW ACP2 (dBc) – 1.98MHz OFFSET – 30kHz RBW 06 05 7- 01 5 Figure 15. CDMA2000 ACP vs. Output Power per Carrier; 4 Adjacent Carriers ADL5322 Rev. 0 | Page 10 of 12 EVALUATION BOARD Figure 17 shows the schematic of the ADL5322 evaluation board. The board is powered by a single supply in the 4.75 V to 5.25 V range. The power supply is decoupled on each of the three power supply pins by 10 μF, 10 nF, and 100 pF capacitors. See Table 5 for exact evaluation board component values. Note that all three VCC pins (Pin 1, Pin 2, and Pin 5) should be independently bypassed as shown in Figure 17 for proper operation. 06 05 7- 01 6 Figure 16. Evaluation Board Component Side View Table 5. Evaluation Board Components Component Function Default Value DUT1 Driver amplifier ADL5322 C1, C12, C16 Low frequency bypass capacitors 10 μF, 0603 C3, C11, C17 Low frequency bypass capacitors 10 nF, 0402 C2, C10, C18 High frequency bypass capacitors 100 pF, 0402 C8, C9, C13, C14, R3 Open Open, 0402 R2, R4 AC coupling capacitors 100 pF, 0402 AGNDAGNDAGND AGND AGND AGND VCC RFIN RFOUT ADL5322/ ADL5323 VCC VCC GND GND RFIN VCC GND RFOUT R2 100pF DUT1 VCCVCC VCC GND 8 7 6 5 1 2 3 4 AGND C2 100pF C1 10µF C3 10nF AGNDAGND C8 OPEN C9 OPEN R4 100pF VCC TP2 VCC SNS1 AGNDAGNDAGND C16 10µF C18 100pF TP1 C17 10nF AGNDAGNDAGND C12 10µF C10 100pF C11 10nF AGNDAGND C13 OPEN C14 OPEN R3 OPEN W1 06 05 7- 01 7 Figure 17. Evaluation Board Schematic ADL5322 Rev. 0 | Page 11 of 12 OUTLINE DIMENSIONS 1 0.50 BSC 0.60 MAX PIN 1 INDICATOR 1.50 REF 0.50 0.40 0.30 2.75 BSC SQTOPVIEW 12° MAX 0.70 MAX0.65 TYP SEATING PLANE PIN 1 INDICATOR 0.90 MAX 0.85 NOM 0.30 0.23 0.18 0.05 MAX 0.01 NOM 0.20 REF 1.89 1.74 1.59 4 1.60 1.45 1.30 3.00 BSC SQ 5 8 Figure 18. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD] 3 mm × 3 mm Body, Very Thin, Dual Lead (CP-8-2) Dimensions shown in millimeters ORDERING GUIDE Model Temperature Range Package Description Package Option Branding Ordering Quantity ADL5322ACPZ-R71 −40°C to +85°C 8-Lead LFCSP_VD, 7" Tape and Reel CP-8-2 OP 1500 ADL5322ACPZ-WP1 −40°C to +85°C 8-Lead LFCSP_VD, Waffle Pack CP-8-2 OP 50 ADL5322-EVAL Evaluation Board 1 1 Z = Pb-free part. ADL5322 Rev. 0 | Page 12 of 12 NOTES ©2006 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06057-0-7/06(0) FEATURES AND BENEFITS: Non-PTFE. • Fabricates like FR4. • Processable by a larger number of fabricators. • UL flammability rating (RO4350). • No special through-hole treatments or handling required. • Lower processing and assembly costs. Excellent high frequency performance due to low dielectric tolerance and loss. • Ideal for applications with higher operating frequency requirements. Stable electrical properties versus frequency. • Repeatable designs. • Ideal for multilayer and mixed dielectric constructions (hybrid). Low thermal coefficient of dielectric constant. • Ideal for applications sensitive to temperature change. Low Z-axis expansion. • Ensures reliable plated through hole quality. Low in-plane expansion coefficient. • Excellent reliability of surface mounted assemblies. • Suitable for use with epoxy glass multilayer board hybrid designs. Excellent dimensional stability. • High production yields. Volume manufacturing process. • Economical laminate pricing. High glass transition temperature (280°C). • Will not warp during reflow assembly. • Ensures plated through hole reliability. Typical Applications: • LNB’s for Direct Broadcast Satellites • Microstrip Patch Antennas • PCS and Cellular Base Station Antennas and Power Amplifiers • Spread Spectrum Communication Systems • RF Identification Tags RO4003®, RO4350® High Frequency Laminates Woven Glass Reinforced Ceramic Filled Thermoset Materials Rogers Corporation, Microwave Materials Division, 100 S. Roosevelt Avenue, Chandler AZ 85226-3415 Tel: 480 961-1382 Fax: 480 961-4533 Rogers Corporation Microwave Materials Division 100 S. Roosevelt Avenue Chandler, AZ 85226-3415 Tel: 480 961-1382 Fax: 480 961-4533 Toll Free: 877 643-7701 Website: http://www.rogers-corp.com/mwu/ ISO 9002 CERTIFIED The information and guidelines contained in this document are intended to assist you in designing with RO4000 series. They are not intended to and do not create any warranties, express or implied, including any warranty of merchantability or fitness for a particular application. The user should determine the suitability of Rogers materials for each application. Values are averages and not guaranteed. RO4003 and RO4350 are licensed trademarks of Rogers Corporation. © 1997,1998, 1999 Rogers Corporation Printed in U.S.A. Revised 10/99 0551-109 -5.0-ON Availability: Standard Thicknesses: RO4350: 0.0066”(0.168mm), 0.010” (0.254mm), 0.020” (0.508mm), 0.030” (0.762mm), 0.060” (1.524mm) RO4003: 0.008” (0.203mm), 0.020” (0.508mm), 0.032” (0.813mm), 0.060” (1.524mm) Standard Sheet Sizes: 24” X18” (610 X 457mm), 12”X18” (305 X 457mm) Standard Copper Cladding: 1/2 oz (17µm) and 1 oz (35µm) electrodeposited copper. Rogers laminates can be purchased by contacting your U.S. customer service representative or one of our overseas offices. Telephone numbers are listed below. In Japan: Rogers Japan Inc., Tokyo 116 Japan Tel: 03-3807-6430 Fax: 03-3807-6319 In Europe: Rogers N.V., Ghent, Belgium Tel: 32-9-2353611 Fax: 32-9-2353658 In Taiwan: Rogers Taiwan Inc., Taipei, Taiwan R.O.C. Tel: 886-2-86609056, Fax: 886-2-86609057 PROPERTY Typical Values RO4003 RO4350 Units Dielectric Constant @10 GHz 3.38 ± 0.05 3.48 ± 0.05 – Thermal Coefficient of εr @ 0 to 100°C +40 +50 ppm/°C Dissipation Factor @10 GHz 0.0027 0.0040 – Youngs Modulus X 3700 (25,510) kpsi (MPa) Y 3900 (26,889) 1664 (11,473) Volume Resistivity 1.7 x 1010 1.2 x 1010 Mohm•cm Surface Resistivity 4.2 x 109 5.7 x 209 Mohm Moisture Absorption 0.06 0.06 % Dimensional Stability X,Y <0.3 <0.5 mm/m Specific Gravity 23°C 1.8 1.9 – Peel Strength 1.1 (6.4) 0.9 (5.3) N/m (pli) Thermal Conductivity 0.64 0.62 W/m/°K Coefficient of Thermal Expansion @ 0 to 100°C X 11 14 Y 14 16 ppm/°C Z 46 50 Glass Transition (Tg) >280 >280 °C UL Flammability Rating NO 94-VO – Rogers Corp Microwave Materials Unit-Standard Thickness.txt Rogers Corp: Microwave Materials Unit/Standard Thickness Division Home | Customer Service | Trade shows | Division Products | Software |Technical Literature High Frequency Laminates| Flexible Circuit Materials Literature | Material Safety Data Sheets | Sign-up on our Mail List | Standard Thickness' and Panels Sizes for RO3000® and RO4000® Series High Frequency Circuit Materials RO3000® Series LaminateStandard Dielectric ThicknessStandard Panel Sizes GradeDielectric Constant RO3003™ RO3035™3.00 3.500.005" (0.13 mm)± 0.0005 0.010"(0.25 mm) ± 0.0007 0.020"(0.50 mm)± 0.001 0.030" (0.75 mm)±0.0015 0.060" (1.52 mm) ±0.00312"x18" (304.8 x457.2 mm) 24"x18" ( 609.6 x457.2 mm) RO3006™ RO3010™6.15 10.20.005" (0.13 mm) ± 0.0005 0.010" (0.25 mm) ±0.0007 0.025" (0.64 mm) ±0.001 0.050" (1.27 mm) ±0.00218"x 12" (457.2 mm x 304.8mm ) 18" x 24"" (457.2 mm x609.6mm) RO3203™3.020.010" (0.254 mm)± 0.0007 0.020" (0.508 mm) ±0.001 0.030" (0.762 mm)±0.0015 0.060" (1.524 mm) ±0.00318" x12' (457.2 X 304.8 mm) 18" x24" (457.2 X 609.6 mm) RO3206™ RO3210™6.15 10.20.025" (0.635 mm) ± 0.001 0.050" (1.27 mm) ±0.00218" x12' (457.2 X 304.8 mm) 18" x24" (457.2 X 609.6 mm) RO3000 series material standard cladding is: 1/2 oz. (17 µm) and 1 oz.(35 µm) two sides RO4000® Series High Frequency Circuit MaterialsStandard Dielectric ThicknessStandard Panel Sizes GradeDielectric Constant RO4003C™3.380.008" (0.203mm) ± 0.0010 0.012" (0.305mm) ± 0.0010 0.016" (0.406mm) ± 0.0015 0.020" (0.508 mm)±0.0015 0.032" (0.813 mm)±0.0020 0.060" (1.524 mm) ±0.004012"x18" (304.8 mm x 457.2mm ) 24"x18" (609.6 mm x 457.2mm ) RO4003C material standard cladding is: 1/2 oz.(17 µm) and 1 oz.(35 µm) electrodeposited copper two sides. 4350B™3.480.0066" (0.168mm) ± 0.0007 0.010" (0.25 mm) ± 0.0010 0.0133" (0.338mm) ± 0.0015 0.0166" (0.422mm) ± 0.0015 0.020" (0.51 mm) ±0.0015 0.030" (0.76 mm)±0.0020 Page 1 Rogers Corp Microwave Materials Unit-Standard Thickness.txt 0.060" (1.52 mm) ±0.004012"x18" (304.8 mm x 457.2mm ) 24"x18" (609.6 mm x457.2mm) RO4350™ material standard cladding is: 1/2 OZ (17mm) and 1 oz. (35 µm) electrodeposited copper two sides Panel sizes and thicknesses for RT/duroid, TMM, and ULTRALAM 2000 high frequency laminates. For other claddings or panel sizes please contact our Customer Service Department. Rogers Corporation, Advanced Circuit Materials Division High Frequency Laminates 100 S. Roosevelt Ave, Chandler, AZ 85226 Flexible Circuit Materials 100 N. Dobson Road, Chandler, AZ 85224 Phone: 480 961-1382/ Fax: 480 961-4533/ Site Feedback Copyright ©2005 Rogers Corporation, All Rights Reserved - Disclaimer - Privacy Policy - Security Statement RT/duroid, TMM, ULTRALAM, R/flex, R/flex CRYSTAL, RO3000, RO3003, RO3035, RO3006, RO3010, RO3200, RO3203, RO3206, RO3210, RO4000, RO4003C, RO4350B are trademarks of Rogers Corporation. The world runs better with Rogers.™ Page 2 ISO 9001 ISO 14001 AS 9100 CERTIFIED Mini-Circuits® P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 The Design Engineers Search Engine Provides ACTUAL Data Instantly at TM Notes: 1. Performance and quality attributes and conditions not expressly stated in this specification sheet are intended to be excluded and do not form a part of this specification sheet. 2. Electrical specifications and performance data contained herein are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. 3. The parts covered by this specification sheet are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp. For detailed performance specs & shopping online see web site minicircuits.com IF/RF MICROWAVE COMPONENTS The Big Deal • Ultra Low Noise Figure, 0.55 dB typ. • High IP3, 30 dBm typ. • Good VSWR, 1.2:1 typ. • Low Current, 40mA at +5V • Integrated Bias Matching and Stabilization Circuits TAMP-960LN+ Key Features Low Noise Amplifier Product Overview The TAMP-960LN+ (RoHS compliant) utilizes advanced E-PHEMT technology in a single stage low noise amplifier design built into a shielded case (size: .591”x.394”x.118”). The drop-in module offers ultra low noise figure and high output IP3 with good input and output return loss over the entire frequency range and without the need of external matching components. Feature Advantages Ultra Low NF With only 0.55 dB NF, the TAMP-960LN+ enables greater sensitivity for receiver applications. It includes all matching and stability circuits making this Drop-in LNA module a turn-key solution for ensuring low system sensitivity in demanding applications. High Output IP3 At +30 dBm IP3, in combination with its low noise performance, the TAMP-960LN+ can improve a systems’ spur-free dynamic range which is often the critical driver in many receiver applications. Low Current, 40mA typ. At only 40mA, the TAMP-960LN+ is ideal for applications with limited available power or densely packed applications where termal and power management is critical. High P1dB: 16.5dBm typ. High P1dB enables the amplifier to operate in linear region in the presence of stronginterfering signals. Well Matched input/ output ports With typical input VSWR of 1.1:1 and output VSWR of 1.35:1, the TAMP-960LN+ can be used in cascade with many 50 Ohm components and maintain minimal interaction or reflections. Drop-in Module Eliminates the need for designers to optimize low noise transistor bias and matching circuitry. The TAMP-960LN+ provides the outstanding combined performance and does not require any external elements. The case PCB area is smaller than most LNA transistor designs with external circuitry. Metal Case Provides a protective enclosure improving handling robustness in addition to shielding thesensitive high gain devices from close by circuitry. Unconditionally stable No adverse effects due to reactive loads at the input and output ports avoiding potential instability which can be a critical requirement when integrating high gain, high frequency devices on an open PCB assembly. 50Ω 824 to 960 MHz CASE STYLE: JQ1382 Page 1 of 4 ISO 9001 ISO 14001 AS 9100 CERTIFIED Mini-Circuits® P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 The Design Engineers Search Engine Provides ACTUAL Data Instantly at TM Notes: 1. Performance and quality attributes and conditions not expressly stated in this specification sheet are intended to be excluded and do not form a part of this specification sheet. 2. Electrical specifications and performance data contained herein are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. 3. The parts covered by this specification sheet are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp. For detailed performance specs & shopping online see web site minicircuits.com IF/RF MICROWAVE COMPONENTS Low Noise Amplifier Surface Mount TAMP-960LN+ Features • Ultra low noise figure, 0.55 dB typ. • High Output IP3, 30 dBm typ. • Output power, up to +16.5 dBm typ. • Low current consumption • Good VSWR, 1.2:1 typ. • Unconditionally stable Applications • Base station transceiver, tower mounted amplifier, repeater • CDMA: 824 to 894 MHz • GSM Rx: 880 to 915 MHz • GSM Tx: 925 to 960 MHz • General purpose low noise amplifier 50Ω 824 to 960 MHz REV. B M130109 TAMP-960LN+ EDR-9276/12PROD RAV 110118 Page 2 of 4 Parameter Condition (MHz) Min. Typ. Max. Units Frequency Range 824 960 MHz Noise Figure 824 - 960 0.55 0.80 dB 824 - 894 0.60 0.80 880 - 915 0.55 0.70 925 - 960 0.55 0.70 Gain 824 - 960 16.5 18.0 dB 824 - 894 16.5 18.0 880 - 915 16.5 18.0 925 - 960 16.5 17.5 Gain Flatness 824 - 960 ± 0.6 ± 1.2 dB 824 - 894 ± 0.4 ± 0.8 880 - 915 ± 0.2 ± 0.4 925 - 960 ± 0.2 ± 0.4 Output Power at 1dB compression 824 - 960 15.5 16.5 dBm 824 - 894 15.5 16.5 880 - 915 15.5 16.5 925 - 960 15.5 16.5 Output third order intercept point (OIP3) 824 - 960 30 dBm 824 - 894 30 880 - 915 30 925 - 960 30 Input VSWR 824 - 960 1.1 :1 824 - 894 1.1 880 - 915 1.1 925 - 960 1.1 Output VSWR 824 - 960 1.4 :1 824 - 894 1.3 880 - 915 1.4 925 - 960 1.5 DC Supply Voltage 5.0 V DC Supply Current 40 45 mA + RoHS compliant in accordance with EU Directive (2002/95/EC) The +Suffix has been added in order to identify RoHS Compliance. See our web site for RoHS Compliance methodologies and qualifications. CASE STYLE: JQ1382 PRICE: $9.95 ea. QTY (5-49) Electrical Specifications at 25°C Maximum Ratings Parameter Ratings Operating Temperature -40°C to 85°C Storage Temperature -55°C to 100°C Operating Voltage 5.5 V Input RF Power (no damage) +10 dBm Power Consumption 250 mW Pin Connections RF IN 10 RF OUT 5 V+ 7 GROUND 1,2,3,4,6,8,9,11 Permanent damage may occur if any of these limits are exceeded. Simplified Schematic ESD Rating Human Body Model (HBM): Class 1A (250 V to < 500 V) in accordance with ANSI/ESD STM 5.1 - 2001 Machine Model (MM): Class M1 (40 V) in accordance with ANSI/ESD STM 5.2 - 1999 RF IN V+ RF OUT GND DUT ISO 9001 ISO 14001 AS 9100 CERTIFIED Mini-Circuits® P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 The Design Engineers Search Engine Provides ACTUAL Data Instantly at TM Notes: 1. Performance and quality attributes and conditions not expressly stated in this specification sheet are intended to be excluded and do not form a part of this specification sheet. 2. Electrical specifications and performance data contained herein are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. 3. The parts covered by this specification sheet are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp. For detailed performance specs & shopping online see web site minicircuits.com IF/RF MICROWAVE COMPONENTS TAMP-960LN+ Outline Dimensions ( )inchmm A B C D E F G H J K L M N P Q R S T U .591 .394 .118 .335 .197 .126 .130 .230 .344 .445 .011 .050 .148 .060 .040 .143 .123 .042 .084 15.0 10.0 3.0 8.5 5.0 3.2 3.3 5.85 8.75 11.3 .28 1.27 3.75 1.52 1.02 3.63 3.13 1.07 2.13 V W Y Z AA AB AC AD AE AF AG AH AJ AK AL AM AN wt. .022 .044 .305 .122 .222 .337 .437 .472 .669 .189 .008 .118 .004 .158 .079 .087 .315 grams .56 1.12 7.75 3.1 5.65 8.55 11.1 12.0 17.0 4.8 .20 3.0 .10 4.0 2.0 2.2 8.0 0.8 Outline Drawing PCB Land Pattern 98-JQ Rev.:A (07 Dec. 08) M120556 File: 98-JQ Rev A (3).doc Sheet 1 of 1 This document and its contents are the property of Mini-Circuits D AE AB AC AD Z AA AG TYP AH AJ TYP AF AL TYP AM TYP AN AK AL ° 98-JQ Rev.:A (07 Dec. 08) M120556 File: 98-JQ Rev A (3).doc Sheet 1 of 1 This document and its contents are the property of Mini-Circuits A E TYP B Q TYP 3X G 11 1 3 4 D A F 10 9 8 5 7 6 C P TYP 3X Y H J K 2 4X L ±.006 N INDEX R S T Radius TYP 3X V Radius TYP 3X W Diam. TYP 8X U Diam. TYP 5X M CHAMFER 45° METALLIZATION SOLDER RESIST Demo Board MCL P/N: TB-468+ Suggested PCB Layout (PL-293) PIN 1 OUT IN V+ 1. TRACE WIDTH IS SHOWN FOR ROGERS RO4350B WITH DIELECTRIC THICKNESS .030" ± .002; COPPER 1/2 OZ. EACH SIDE. FOR OTHER MATERIALS TRACE WIDTH MAY NEED TO BE MODIFIED. 2. BOTTOM SIDE OF THE PCB IS CONTINUOUS GROUND PLANE. NOTES: DENOTES PCB COPPER LAYOUT WITH SMOBC (SOLDER MASK OVER BARE COPPER) DENOTES COPPER LAND PATTERN FREE OF SOLDER MASK Page 3 of 4 ISO 9001 ISO 14001 AS 9100 CERTIFIED Mini-Circuits® P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 The Design Engineers Search Engine Provides ACTUAL Data Instantly at TM Notes: 1. Performance and quality attributes and conditions not expressly stated in this specification sheet are intended to be excluded and do not form a part of this specification sheet. 2. Electrical specifications and performance data contained herein are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. 3. The parts covered by this specification sheet are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp. For detailed performance specs & shopping online see web site minicircuits.com IF/RF MICROWAVE COMPONENTS TAMP-960LN+ Page 4 of 4 Typical Performance Data/Curves TAMP-960LN+ GAIN 17.5 18.0 18.5 19.0 19.5 20.0 820 840 860 880 900 920 940 960 FREQUENCY (MHz) G AI N (dB ) FREQUENCY GAIN DIRECTIVITY VSWR VSWR NOISE P. OUT @ 1dB OUTPUT (MHz) (dB) (dB) IN OUT FIGURE COMPR. IP3 (:1) (:1) (dB) (dBm) (dBm) 824.00 19.26 6.03 1.18 1.30 0.67 16.98 29.63 830.00 19.20 6.02 1.17 1.30 0.49 16.97 29.84 835.00 19.14 6.02 1.16 1.31 0.51 16.93 30.08 845.00 19.03 6.08 1.15 1.32 0.58 16.96 30.54 850.00 18.96 6.14 1.14 1.32 0.52 17.01 30.44 855.00 18.91 6.12 1.14 1.32 0.54 17.05 30.69 860.00 18.86 6.16 1.13 1.33 0.54 17.03 30.53 870.00 18.75 6.19 1.12 1.33 0.59 17.07 29.81 875.00 18.68 6.25 1.11 1.34 0.55 17.06 29.78 880.00 18.64 6.27 1.10 1.34 0.59 17.03 29.84 885.00 18.57 6.29 1.10 1.34 0.47 17.04 29.85 894.00 18.48 6.28 1.09 1.35 0.53 16.95 29.98 900.00 18.41 6.33 1.08 1.35 0.48 16.83 30.84 905.00 18.35 6.36 1.08 1.36 0.44 16.88 30.81 915.00 18.25 6.41 1.07 1.37 0.51 17.01 31.10 925.00 18.14 6.43 1.06 1.37 0.46 17.02 30.72 930.00 18.09 6.43 1.06 1.37 0.61 17.02 30.77 935.00 18.04 6.48 1.05 1.37 0.52 17.02 30.70 945.00 17.93 6.50 1.05 1.38 0.51 17.06 30.23 960.00 17.78 6.54 1.04 1.39 0.49 16.75 31.15 TAMP-960LN+ OUTPUT POWER AT 1dB COMPRESSION 15 16 17 18 19 20 820 840 860 880 900 920 940 960 FREQUENCY (MHz) O UT PU T PO W ER (d Bm ) TAMP-960LN+ NOISE FIGURE 0.0 0.2 0.4 0.6 0.8 1.0 820 840 860 880 900 920 940 960 FREQUENCY (MHz) N O IS E FI G UR E (dB ) TAMP-960LN+ OUTPUT IP3 26 28 30 32 34 36 820 840 860 880 900 920 940 960 FREQUENCY (MHz) IP 3 (dB m ) TAMP-960LN+ DIRECTIVITY 5.8 6.0 6.2 6.4 6.6 6.8 820 840 860 880 900 920 940 960 FREQUENCY (MHz) D IR EC TI VI TY (d B) TAMP-960LN+ VSWR 1.0 1.1 1.2 1.3 1.4 1.5 820 840 860 880 900 920 940 960 FREQUENCY (MHz) VS W R IN OUT ISO 9001 ISO 14001 AS 9100 CERTIFIED Mini-Circuits® P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 The Design Engineers Search Engine Provides ACTUAL Data Instantly at ® Notes: 1. Performance and quality attributes and conditions not expressly stated in this specification sheet are intended to be excluded and do not form a part of this specification sheet. 2. Electrical specifications and performance data contained herein are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. 3. The parts covered by this specification sheet are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp. For detailed performance specs & shopping online see web site minicircuits.com IF/RF MICROWAVE COMPONENTS Page 1 The Big Deal: Product Overview: YSF-122+ is an advanced amplifier module in a Mini-Circuits System In Package ™ . This module is fully matched to 50Ω in/out impedance and has built-in Input & Output DC block capacitors. It is enclosed in a 5 x 6 mm MCLP plastic package. The YSF-122+ uses E-PHEMT technology enabling it to work with a single positive supply voltage. Feature Advantages Superior Gain Flatness ± 0.2dB The YSF-122+ provides industry leading gain flatness over the full cellular communi- cations L band (800-1200 MHz) making this ideal for use in applications where gain- flatness and repeatability are critical performance requirements. High Gain The YSF-122+ is a two-stage design with internal feedback and bias to provide flat 20 dB nominal gain, supporting applications where a single gain block must overcome large system losses such as long cable runs and lossy components. Strong Combination of Performance The YSF-122+ provides a strong combination of performance parameters including high gain (20 dB), high IP3 (+37 dBm) and P1dB (+20 dBm) and low noise figures (3.4 dB) that are difficult to achieve in a single stage design and available only in the YSF amplifier series. Integrated Matching, DC Blocking and Bias in Small Package The YSF-122+ includes all support circuits including: Matching, Bias and DC Block- ing, all integrated into a single 5x6mm package making the total footprint equal to or smaller than most solutions. Excellent Return Loss The YSF-122+ includes integrated input and output matching and bias circuits to make this amplifier a simple, complete drop-in solution. The matching circuits provide excellent output return loss (17dB), and are designed to give optimal P1dB and IP3 performance in a 50Ω environment. High Reverse Isolation With 30 dB of reverse isolation – the YSF-122+ is an ideal gain block for use in inte- grated systems to minimize VSWR interactions resulting from cascading highly reflec- tive components such as sharp filters. YSF-122+ Key Features ™ Mini-Circuits System In Package Flat Gain Amplifier • Ultra Flat Gain Response: ± 0.2 dB over 800-1200 MHz • Excellent Combination of gain, P1dB, IP3 and NF • 50Ω Input and Output: no External Components Required CASE STYLE: DL1020 ISO 9001 ISO 14001 AS 9100 CERTIFIED Mini-Circuits® P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 The Design Engineers Search Engine Provides ACTUAL Data Instantly at ® Notes: 1. Performance and quality attributes and conditions not expressly stated in this specification sheet are intended to be excluded and do not form a part of this specification sheet. 2. Electrical specifications and performance data contained herein are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. 3. The parts covered by this specification sheet are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp. For detailed performance specs & shopping online see web site minicircuits.com IF/RF MICROWAVE COMPONENTS Page 2 Product Features • Matched 50-ohm surface mount amplifier • High gain, 20 dB typ. • Up to +20 dBm typ. output power • High IP3, +37 dBm • Low Noise Figure, 3.4 dB typ. • High directivity, 32 dB isolation • Internal Input & Output DC Block • Separate terminal for DC REV. OR M128712 YSF-122+ 110126 0.8-1.2 GHz YSF-122+ CASE STYLE: DL1020 PRICE: $2.69 ea. QTY. (20) + RoHS compliant in accordance with EU Directive (2002/95/EC) The +Suffix has been added in order to identify RoHS Compliance. See our web site for RoHS Compliance methodologies and qualifications. Typical Applications • Cellular • Portable Wireless • Receivers & transmitters • Radar General Description YSF-122+ is an advanced amplifier module in a Mini-Circuits System In Package ™ . This module is fully matched to 50Ω in/out impedance and has built-in Input & Output DC block capacitors. It is enclosed in a 5 x 6 mm MCLP plastic package. The YSF-122+ uses E-PHEMT* technology enabling it to work with a single positive supply voltage. simplified schematic and pad description Function Pad Number Description RF-IN 5 RF Input RF-OUT 3 RF Output DC 4 DC Supply GND Paddle Connected to ground NOT USED 1,2,6,7,8 No internal connection *Enhancement mode Pseudomorphic High Electron Mobility Transistor ™ Mini-Circuits System In Package Flat Gain Amplifier 8 NC 7 NC 6 NC 5 RF IN NC 1 NC 2 RF OUT 3 DC IN 4 PADDLE RF IN RF OUT DC ISO 9001 ISO 14001 AS 9100 CERTIFIED Mini-Circuits® P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 The Design Engineers Search Engine Provides ACTUAL Data Instantly at ® Notes: 1. Performance and quality attributes and conditions not expressly stated in this specification sheet are intended to be excluded and do not form a part of this specification sheet. 2. Electrical specifications and performance data contained herein are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. 3. The parts covered by this specification sheet are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp. For detailed performance specs & shopping online see web site minicircuits.com IF/RF MICROWAVE COMPONENTS Page 3 Flat Gain Amplifier ™ Electrical Specifications(1) at 25°C, Zo=50Ω unless noted YSF-122+ Parameter Condition (MHz) Min. Typ. Max. Units Frequency Range 800 1200 MHz Gain 800 18.1 20.1 22.1 dB1000 18.4 20.4 22.4 1200 18.3 20.3 22.3 Gain Flatness ±0.2 dB Input Return Loss 800 8.8 dB1000 9.0 11.0 1200 11.0 Output Return Loss 800 13.0 dB1000 11.0 15.0 1200 17.3 Reverse Isolation 32.0 dB Output Power @1 dB compression 800 20.5 dBm1000 18.5 20.5 1200 20.4 Output Power @ 3 dB compression 21.3 dBm Output IP3 800 37.0 dBm1000 31.0 36.0 1200 36.0 Noise Figure 800 3.5 dB1000 3.4 4.4 1200 3.4 Device Operating Voltage 5 V Device Operating Current 118 145 mA Device Current Variation vs. Temperature(2) 2 µA/°C Device Current Variation vs Voltage 0.002 mA/mV Thermal Resistance, junction-to-ground lead (3) 56 °C/W (1) Measured on Mini-Circuits Characterization test board TB-589+. See Characterization Test Circuit (Fig. 1) (2) D(+85°C to -45°C) (3) Thermal Resistance= Hot spot temperature - Ground lead temperature Power Dissipation Absolute Maximum Ratings Parameter Ratings Units Operating Temperature(4) -40 to 85 °C Storage Temperature -65 to 150 °C DC Voltage on Pad 4 7 V Power Dissipation 1.5 W Input Power 21 dBm Note: Permanent damage may occur if any of these limits are exceeded. These ratings are not intended for continuous normal operation. (4) Case is defined as ground paddle. DC Current Histogram 90 95 100 105 110 115 120 125 130 135 140 145 150 155 DC Current (mA) USL USL=Upper Spec Limit ISO 9001 ISO 14001 AS 9100 CERTIFIED Mini-Circuits® P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 The Design Engineers Search Engine Provides ACTUAL Data Instantly at ® Notes: 1. Performance and quality attributes and conditions not expressly stated in this specification sheet are intended to be excluded and do not form a part of this specification sheet. 2. Electrical specifications and performance data contained herein are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. 3. The parts covered by this specification sheet are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp. For detailed performance specs & shopping online see web site minicircuits.com IF/RF MICROWAVE COMPONENTS Page 4 Flat Gain Amplifier ™ Fig 1. Block Diagram of Test Circuit used for characterization. (DUT soldered on Mini-Circuits Characterization Test Fixture TB-589+) Gain, Return loss, Output power at 1dB compression (P1 dB), Output IP3 (OIP3) and Noise Figure measured using Agilent’s N5242A PNA-X microwave network analyzer. Conditions: 1. Gain: Pin= -25dBm 2. Output IP3 (OIP3): Two tones, spaced 10 MHz apart, 2.5 dBm/tone at output. Characterization Test Circuit Recommended Application Circuit (refer to evaluation board for PCB Layout and component values) Fig 2. Recommended Application Circuit YSF-122+ Product Marking YSF index over pin 1 RF-IN RF-OUT Vs (Supply Voltage) 5 4 3 TB-589+ RF-IN RF-OUT Vs 5 4 3 C1 Paddle ISO 9001 ISO 14001 AS 9100 CERTIFIED Mini-Circuits® P.O. Box 350166, Brooklyn, New York 11235-0003 (718) 934-4500 Fax (718) 332-4661 The Design Engineers Search Engine Provides ACTUAL Data Instantly at ® Notes: 1. Performance and quality attributes and conditions not expressly stated in this specification sheet are intended to be excluded and do not form a part of this specification sheet. 2. Electrical specifications and performance data contained herein are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. 3. The parts covered by this specification sheet are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp. For detailed performance specs & shopping online see web site minicircuits.com IF/RF MICROWAVE COMPONENTS Page 5 Flat Gain Amplifier ™ YSF-122+ ESD Rating Human Body Model (HBM): Class 1A in accordance with ANSI/ESD STM 5.1 - 2001 Machine Model (MM): Class M1 (25V) in accordance with ANSI/ESD STM5.2-1999 MSL Rating Moisture Sensitivity: MSL1 in accordance with IPC/JEDEC J-STD-020D Attention Observe precautions for handling electrostatic sensitive devices Visual Inspection Electrical Test SAM Analysis Reflow 3 cycles, 260°C Soak 85°C/85RH 168 hours Bake at 125°C, 24 hours Visual Inspection Electrical Test SAM Analysis Start MSL Test Flow Chart Additional Detailed Technical Information (additional information is available on our web site. To access this information enter the model number on our web site home page) Performance Data Data Table go! Swept Graphs go! S-Parameter (S2P Files) Data Set (.zip file) go! Case Style DL1020 Plastic package, exposed paddle, lead finish: tin/silver/nickel go! Tape & Reel F68 go! Standard quantities available on reel 7” reels with 20, 50, 100, 200, 500, or 1K devices. Suggested Layout for PCB Design PL-335 go! Evaluation Board TB-589-2+ go! Environmental Ratings ENV08T1 go! Data Sheet Part Number 856356 836.5/881.5 MHz SAW Duplexer Subject to change or obsolescence without notice Rev E 01/09 © TriQuint Semiconductor Page 1 of 7 Features • For CDMA, WCDMA 850 and AMPS applications • Usable bandwidth 25 MHz (each band) • High Tx-Rx isolation • Low insertion loss • High attenuation • Single-ended operation • No matching required for operation at 50Ω • Ceramic Surface Mount Package (SMP) • Hermetic • Qualified for Automotive Applications • Manufacturing facilities are certified with ISO/TS 16949:2002 • RoHS compliant (2002/95/EC), Pb-free • Package Pin Configuration Surface Mount 3.80 x 3.80 x 1.47 mm Bottom View SMP-15F 12 10 11 9 4 5 6 78 1 32 Pin No. Description 5 Rx 8 Antenna 11 Tx 1,2,3,4,6 Case ground 7,9,10,12 Case ground 1.60 0.60 3.80 0.45 0.80 1.47 NOM. 1.65 MAX. 3.80 0.15x45° CHAMFER 0.90 0.86 Dimensions shown are nominal in millimeters All tolerances are ±0.15mm except overall length and width ±0.10mm Body: Al2O3 ceramic Lid: Kovar, Ni plated Terminations: Au plating 0.5 - 1.0µm, over a 2 - 6µm Ni plating Pb Data Sheet Part Number 856356 836.5/881.5 MHz SAW Duplexer Subject to change or obsolescence without notice Rev E 01/09 © TriQuint Semiconductor Page 2 of 7 Electrical Specifications (1) Operating Temperature: (2) +25 oC Parameter (3) Minimum Typical Maximum Unit Tx-Ant Specification Center Frequency - 836.5 - MHz Maximum Insertion Loss (4) 824 - 849 MHz - 1.9 2.3 dB Amplitude Ripple 824 - 849 MHz - 0.5 0.7 dB Absolute Attenuation 10 - 750 MHz 869 - 894 MHz 1050 - 1100 MHz 1250 - 1325 MHz 24 45 20 14 30 50 24 18 - - - - dB dB dB dB Second Harmonic Attenuation 1648 - 1698 MHz 7 10 - dB Third Harmonic Attenuation 2472 - 2547 MHz 8 12 - dB Return Loss at Tx Terminal (4) 824 - 849 MHz 10 13 - dB Ant-Rx Specification Center Frequency - 881.5 - MHz Maximum Insertion Loss (4) 869 - 894 MHz - 2.3 3.0 dB Amplitude Ripple 869 - 894 MHz 869 - 894 MHz (over any 5MHz span) - - 0.6 0.4 1.2 0.8 dB dB Absolute Attenuation 10 - 779 MHz 779 - 804 MHz 824 - 849 MHz 1039 - 1065 MHz 1100 - 1270 MHz 1648 - 1698 MHz 2472 - 2547 MHz 3000 - 6000 MHz 25 34 52 30 36 35 20 7 32 38 56 38 42 42 27 10 - - - - - - - - dB dB dB dB dB dB dB dB Return Loss at Rx Terminal (4) 869 - 894 MHz 9 12 - dB Tx-Rx Specification Tx to Rx Isolation 824 - 849 MHz 869 - 894 MHz 55 45 60 50 - - dB dB Notes: 1. All specifications are based on the test circuit shown on page 6 2. This specification is valid for room temperature only. The specification over the full temperature range(s) is available on the next page(s) 3. Electrical margin has been built into the design to account for the variations due to manufacturing tolerances 4. Excluding losses due to PCB Data Sheet Part Number 856356 836.5/881.5 MHz SAW Duplexer Subject to change or obsolescence without notice Rev E 01/09 © TriQuint Semiconductor Page 3 of 7 Electrical Specifications (1) Operating Temperature Range: (2) -30 to +85 oC Parameter (3) Minimum Typical Maximum Unit Tx-Ant Specification Center Frequency - 836.5 - MHz Maximum Insertion Loss (4) 824 - 849 MHz - 1.9 2.3 dB Amplitude Ripple 824 - 849 MHz - 0.6 1 dB Absolute Attenuation 10 - 750 MHz 869 - 894 MHz 1050 - 1100 MHz 1250 - 1325 MHz 24 45 20 14 30 50 24 18 - - - - dB dB dB dB Second Harmonic Attenuation 1648 - 1698 MHz 7 10 - dB Third Harmonic Attenuation 2472 - 2547 MHz 8 12 - dB Return Loss at Tx Terminal (4) 824 - 849 MHz 10 12 - dB Ant-Rx Specification Center Frequency - 881.5 - MHz Maximum Insertion Loss (4) 869 - 894 MHz - 2.6 3.2 dB Amplitude Ripple 869 - 894 MHz 869 - 894 MHz (over any 5MHz span) - - 0.9 0.4 1.4 0.8 dB dB Absolute Attenuation 10 - 779 MHz 779 - 804 MHz 824 - 849 MHz 1039 - 1065 MHz 1100 - 1270 MHz 1648 - 1698 MHz 2472 - 2547 MHz 3000 - 6000 MHz 25 34 50 30 36 35 20 7 32 38 56 38 42 42 27 10 - - - - - - - - dB dB dB dB dB dB dB dB Return Loss at Rx Terminal (4) 869 - 894 MHz 9 12 - dB Tx-Rx Specification Tx to Rx Isolation 824 - 849 MHz 869 - 894 MHz 54 45 60 49 - - dB dB Notes: 1. All specifications are based on the test circuit shown on page 6 2. In production, devices will be tested at room temperature to a guardbanded specification to ensure electrical compliance over temperature 3. Electrical margin has been built into the design to account for the variations due to temperature drift and manufacturing tolerances 4. Excluding losses due to PCB Data Sheet Part Number 856356 836.5/881.5 MHz SAW Duplexer Subject to change or obsolescence without notice Rev E 01/09 © TriQuint Semiconductor Page 4 of 7 Electrical Specifications (1) Operating Temperature Range: (2) -40 to +85 oC Parameter (3) Minimum Typical Maximum Unit Tx-Ant Specification Center Frequency - 836.5 - MHz Maximum Insertion Loss (4) 824 - 849 MHz - 1.9 2.5 dB Absolute Attenuation DC - 800 MHz 869 - 894 MHz 1715 - 1785 MHz 12 42 7 30 50 10 - - - dB dB dB Second Harmonic Attenuation 1648 - 1698 MHz 7 10 - dB Third Harmonic Attenuation 2472 - 2547 MHz 8 12 - dB Return Loss at Tx Terminal (4) 824 - 849 MHz 10 12 - dB Ant-Rx Specification Center Frequency - 881.5 - MHz Maximum Insertion Loss (4) 869 - 894 MHz - 2.6 3.6 dB Absolute Attenuation DC - 800 MHz 824 - 849 MHz 1738 - 1788 MHz 2604 - 2682 MHz 25 50 25 15 32 56 30 22 - - - - dB dB dB dB Return Loss at Rx Terminal (4) 869 - 894 MHz 9 12 - dB Tx-Rx Specification Tx to Rx Isolation 824 - 849 MHz 869 - 894 MHz 54 44 60 49 - - dB dB Notes: 1. All specifications are based on the test circuit shown on page 6 2. In production, devices will be tested at room temperature to a guardbanded specification to ensure electrical compliance over temperature 3. Electrical margin has been built into the design to account for the variations due to temperature drift and manufacturing tolerances 4. Excluding losses due to PCB Data Sheet Part Number 856356 836.5/881.5 MHz SAW Duplexer Subject to change or obsolescence without notice Rev E 01/09 © TriQuint Semiconductor Page 5 of 7 Typical Performance Data Sheet Part Number 856356 836.5/881.5 MHz SAW Duplexer Subject to change or obsolescence without notice Rev E 01/09 © TriQuint Semiconductor Page 6 of 7 Matching Schematics Actual matching values may vary due to PCB layout and parasitics 50 Ω Single-ended Input 1,2,3,4,6 7,9,10,12 8 11 5 ANT 50Ω Ω50 50Ω 50 Ω Single-ended Input 1,2,3,4,6 7,9,10,12 8 11 5 ANT 50Ω Ω50 50Ω Marking PCB Footprint ID dot Sawtek logo Date code JJJYM Y code Marking 1.11 4.01 0.65 0.14 0.80 1.60 0.15x45° CHAMFER The date code consists of: JJJ = Julian day, Y = last digit of year, M = manufacturing site code This footprint represents a recommendation only Dimensions shown are nominal in millimeters Tape and Reel Ø1.52.00.3 8.0 4.0 4.1 4.11.8 1.75 5.512.0 Ø1.5 A A Section A-A Ø330 Direction of travel2.0 Ø13.0 Ø20.2 2.7 12.8 Ø102 Sawtek logo ID dot Dimensions shown are nominal in millimeters Packaging quantity: 4000 units/reel Data Sheet Part Number 856356 836.5/881.5 MHz SAW Duplexer Subject to change or obsolescence without notice Rev E 01/09 © TriQuint Semiconductor Page 7 of 7 Maximum Ratings Parameter Symbol Minimum Maximum Unit Operating Temperature Range T -30 +85 oC Storage Temperature Range Tstg -40 +85 oC RF Power Pin - +31 dBm Important Notes Warnings • Electrostatic Sensitive Device (ESD) • Avoid ultrasonic exposure RoHS Compliance • This product complies with EU directive 2002/95/EC (RoHS) Solderability Compatible with JEDEC J-STD-020C Pb-free process, 260°C peak reflow temperature (see soldering profile) Links to Additional Technical Information PCB Layout Tips Qualification Flowchart Soldering Profile S-Parameters Other Technical Information TriQuint’s liability is limited only to the Surface Acoustic Wave (SAW) component(s) described in this data sheet. TriQuint does not accept any liability for applications, processes, circuits or assemblies, which are implemented using any TriQuint component described in this data sheet. Contact Information PO Box 609501 Orlando, FL 32860-9501 USA Phone: +1 (407) 886-8860 Fax: +1 (407) 886-7061 Email: info-product@tqs.com Web: www.triquint.com Or contact one of our worldwide Network of sales offices, Representatives or distributors Pb